Produk & keunggulan
No-Clean Solder Paste CS951
CS951 is a distinctive low-residue high-temperature die attach solder paste. Post-reflow flux residues only account for 0.4% of the total paste weight (equivalent to 4% of the flux weight). By comparison, conventional die attach pastes leave residues at 30–40% of the flux weight. Thanks to its ultra-low residual content, CS951 enables true no-clean processing for certain packaging products. While delivering minimal residues, CS951 maintains outstanding soldering performance with extremely low void formation and excellent wettability on all common metallization surfaces. Furthermore, its residues feature excellent compatibility with epoxy molding compounds, eliminating delamination between substrate-residue interfaces and residue-molding compound interfaces.
Lead-Free Solder Paste LF-217P
LF-217P is a no-clean lead-free solder paste suitable for both air and nitrogen reflow soldering, compatible with lead-free alloy systems including SnAgCu, SnAg and SnSb. Boasting outstanding oxidation resistance, ultra-low void rate and high stencil transfer efficiency, LF-217P is ideal for automotive electronics and precision SMT processes. It delivers reliable probe test performance and can significantly reduce failure rates during In-Circuit Test (ICT).
Solder Preform
Solder preforms are customized soldering blanks fabricated from solder alloys according to product geometry and process requirements to address specialized soldering demands. They drastically minimize voids generated during solder paste reflow and boost joint reliability, with zero flux splattering and post-reflow residues. In addition, they deliver consistent solder volume and uniform, repeatable soldering performance. Widely used for bonding IGBT and other power semiconductor dies to DBC substrates, as well as DBC substrates to heat sinks, they are also suitable for tin replenishment on large pads or through-holes, plus localized soldering scenarios difficult to accomplish via alternative processes. Huaqing supplies solder preforms (strips) in a full range of dimensions, alloy compositions and packaging formats.
Formic Acid Soldering Solder Paste Series
This product is a new formulation exclusively developed for formic acid soldering processes.Traditionally, clean solder preforms were adopted in formic acid soldering to eliminate void defects and post-soldering cleaning requirements common to standard solder paste processes. However, preforms feature no inherent tackiness, requiring custom tooling fixtures to fix components or dies in position. This creates major production bottlenecks for assemblies with abundant small pads such as NTC thermistors and pin terminals. Our formic acid solder paste series delivers strong adhesion to easily secure tiny components and dies. It also resolves the issue of heavy flux residues that demand post-reflow cleaning with conventional solder pastes.
Water-Soluble Lead-Free Solder Paste WS820P
WS820P is a water-soluble lead-free solder paste engineered for high-reliability precision assembly. It is compatible with SnAgCu lead-free alloys as well as high-temperature SnSb lead-free alloy series. WS820P delivers robust soldering activity and outstanding aqueous cleanability. When reflowed under nitrogen atmosphere, the void rate can be controlled below 10%; with vacuum-assisted reflow, void rate drops to less than 1%. WS820P is also applicable to die attach processes. No discoloration or corrosion will occur on dies or lead frames after reflow, and no residual marks remain after aqueous cleaning. While possessing superior soldering performance, WS820P maintains excellent process stability. Its soldering performance barely degrades after 12 consecutive hours of printing under standard operating conditions, retaining stable printing and soldering capability even in harsh production environments. WS820P features a wide reflow process window, compatible with diverse thermal profiles, ensuring consistent high-quality solder joints on areas with varying thermal mass.
Water-soluble Flux WSF-B20
WSF-B20 is a water-soluble flux dedicated to flip-chip bumping and BGA ball mounting processes. Halogen-free and compliant with copper mirror test standards, WSF-B20 delivers excellent soldering wettability and ultra-low void formation in solder joints.
Sorder Wire
Achieve low-cost, high-quality die attach bonding； Lower soldering cost for solder wire process compared with solder preform technology ； Minimal surface scratches and oxide film, paired with excellent wettability to enable flux-free soldering ； Premium surface finish of solder wire effectively restrains void generation.
Ultra-low Residue No-clean Flux
NCF-U11 is a halogen-free, ultra-low-residue no-clean flux optimized specifically for Flip Chip and Thermal Compression Bonding (TCB) processes. It leaves less than 5% residual flux with zero corrosivity. Moreover, these minimal residues feature excellent compatibility with molding compounds and will not trigger defects such as delamination during reliability testing.